The EM100 series e.MMC is purpose-built for consumer electronics and select industrial applications, providing optimal performance within a temperature range of -25˚C to 85˚C. It boasts premium NAND flash memory in a standard 153-ball FBGA package with the JEDEC e.MMC 5.1 interface and HS400 DDR mode, making it an ideal choice for data-intensive workloads
e.MMC 5.1
HS400
Specifications
153-ball FBGA
Package
40°C to 85°C
Wide temperature
Up to
128GB
Capacity
Up to
295MB/s
Sustained Performance
Compatible with Major System Platforms
The EM100 is certified for seamless compatibility with a wide range of leading-brand system platforms and models such as MediaTek MT8163, MT6753, Qualcomm S801, and Intel’s Cherry Trail, Apollo Lake, and Celeron N4000.
Designed for a Wide Range of Applications
The Exascend EM100 series features an extended operating temperature range (-25˚C to 85˚C), making it suitable for both embedded applications like point of sales (PoS) systems, smart home appliances, set-top boxes (STBs), gaming consoles, and mobile devices such as smartphones, tablets, wearables, and more.
Optimized and Reliable Performance
Exascend’s e.MMC incorporates advanced technologies such as LDPC-based ECC, power loss protection, wear levelling, IOPS optimization, read disturb protection, secure erase, write protection, and more.
High-Performance e.MMC for Commercial Applications
Key features:
JEDEC e.MMC 5.1 compliance with backward compatibility (v4.41/v4.5/v5.0)
High Speed 400 (HS400) DDR mode
Up to 295 MB/s sequential read and 197 MB/s sequential write
Densities ranging from 4 GB to 128 GB (4 GB and 8 GB in MLC NAND)
SMART health monitor software inclusive
Purpose-built to meet the demands of embedded applications and mobile devices such as smartphones, set-top boxes (STBs), gaming consoles, PoS systems, and more.