The EM300 series e.MMC is purpose-built for industrial applications, providing optimal performance within a temperature range of -40˚C to 85˚C. It boasts premium NAND flash memory in a standard 153-ball FBGA package with the JEDEC e.MMC 5.1 interface and HS400 DDR mode, making it an ideal choice for data-intensive workloads.
e.MMC 5.1
HS400
Specifications
153-ball FBGA
Package
40°C to 85°C
Wide temperature
Up to
128GB
Capacity
Up to
295MB/s
Sustained Performance
Compatible with Major System Platforms
The EM300 is certified for seamless compatibility with a wide range of leading-brand system platforms and models such as MediaTek MT8163, MT6753, Qualcomm S801, and Intel’s Cherry Trail, Apollo Lake, and Celeron N4000.
Designed to Excel in Diverse Applications
With its wide operating temperature range spanning from -40˚C to 85˚C, the EM300 series is tailor-made for a variety of industrial applications such as IoT gateways, embedded PCs, factory automation, drones, and more.
Optimized with Reliable Performance
Exascend’s e.MMC incorporates advanced technologies such as LDPC-based ECC, power loss protection, wear levelling, IOPS optimization, read disturb protection, secure erase, write protection, and more.
High-Performance e.MMC for Industrial Applications
Series highlights:
JEDEC e.MMC 5.1 compliance with backward compatibility (v4.41/v4.5/v5.0)
High Speed 400 (HS400) DDR mode
Up to 295 MB/s sequential read and 197 MB/s sequential write
Densities ranging from 4 GB to 128 GB (4 GB and 8 GB in MLC NAND)
SMART health monitor software inclusive
Purpose-built to meet the demands of embedded and industrial applications, such as IoT gateways, embedded PCs, factory automation, drones, and more.