HOSIN Global
Committed to provide a group of High-Tech professionals for the industry, Now and Future .
Embedded Flash Module
eMMC
Application Area
Specifications
ePOP / eMCP
Application Area
UFS
Application Area
Specifications
SSD
2.5”SATA SSD
Application Area
Specifications
M.2 2280 SSD
Application Area
Specifications
M.2 2242 SSD
Application Area
Specifications
mSATA SSD
Application Area
Specifications
M.2 PCIe GEN4X4 2280
Application Area
Specifications
M.2 PCIe GEN3X4 2280
Application Area
Specifications
Portable SSD
Application Area
Specifications
Removable Storage
U3 G2 PCBA
Application Area
Specifications
3 in one PCBA
Application Area
Specifications
Two Connectors PCBA
Application Area
Specifications
Two Connectors PCBA
Application Area
Specifications
TYPE-C PCBA
Application Area
Specifications
U3 MUDP
Application Area
Specifications
Two Connectors MUDP
Application Area
Specifications
U3 UDP
Application Area
Specifications
U2 UDP
Application Area
Specifications
U2 MUDP
Application Area
Specifications
U2 OTG MUDP
Application Area
Specifications
DDR
DDR3 / DDR4
Application Area
Specifications
LPDDR
LPDDR
Application Area
DRAM Module
DRAM Module
Application Area
Specifications
