PI3 Series

PI3 SERIES

The PI3 series presents a PCIe 3.0 storage solution, incorporating 3D TLC NAND technology tailored for industrial applications. It offers flexible form factors including M.2 2280 and U.2. Storage capacities range from 240GB to an impressive 7.68TB.

PCIe 3.0

NVMe 1.2

Interface

3D TLC

Flash

40°C to 85°C

Wide temperature

Up to

7.68TB

Capacity

Up to

3,100MB/s

Sustained Performance

Maximum Ruggedness

The PI3 series ensures durability in challenging conditions, withstanding extreme temperatures, vibrations, shocks, and environmental hazards.

High-Capacity Industrial-Grade SSDs

Excelling in strategic partnerships, chip design optimization, cutting-edge controllers, and efficient heat dissipation, our high-capacity SSDs provide exceptional performance, reliability, and longevity for extensive data processing and rigorous benchmarks.

Fully Customizable Flash Storage Solutions

By collaborating with top-tier NAND flash manufacturers and SSD controller creators, Exascend has engineered a bespoke firmware architecture that seamlessly unites advanced hardware and innovative design. This empowers flash storage, providing tailored solutions for success.

Unleashing Industrial Performance with NVMe SSD

Series highlights:

High sustained PCIe Gen3 performance: Sequential read/write speeds up to 3100 MB/s and 1600 MB/s.
High-capacity configurations: Up to 3.84 TB for M.2 2280 and 7.68 TB for U.2 form factors.
Rugged design: Crafted for industrial environments, enduring temperatures from -40°C to 85°C.
Adaptive Thermal Control™ algorithm: Enables temperature monitoring and intelligent management.
Security at its core: TCG Opal 2.0 compliant with AES-256 encryption support; hardware secure erase and temper-proof firmware available.
Enhanced power efficiency: Ensures optimal performance for your industrial needs